AMD SP5 socket has been confirmed
It didn’t take long for the rumors about AMD’s next-gen SP6 socket to already find a confirmation through newly leaked photos.
Over at AnandTech forums one can find photos and schematics for the socket codenamed SP6. This socket has been explained in leaked slides as a platform for edge and telco systems, therefore, where power optimizations are just as crucial as performance. According to those slides, this socket would support up to 32-core Genoa (Zen4) EPYC processors and up to 64-core Bergamo (Zen4c) series. The power would also be limited to 225W, which is nearly half of what the full SP5 socket can support.
AMD SP6 (LGA4844), Source: SteinFG
The SP6 socket looks more or less the same as the SP3 socket for the current Milan series. In fact, the size is identical (58.5 x 75.4 mm), however the SP6 has a different LGA package with 4844 contact pins. That’s a significant reduction from 6096 for the SP5 socket.
- Socket SP3 – LGA 4094 -58.5 x 75.4mm
- Socket SP5 – LGA 6096 – 76.0 x 80.0mm
- Socket SP6 – LGA 4844 -58.5 x 75.4mm
It goes without saying, but SP6, SP5 and SP3 processors will not be compatible with each other. This also means that AMD has to make two different EPYC Genoa/Turin series for each socket.
This document defines the requirements for a 4844-position, 0.94 mm × 0.81 mm interstitial pitch, surface-mount land-grid array (SM-LGA) socket—herein referred to as the Socket SP6—for use with the AMD 4844-position organic land grid array (OLGA) package that has substrate dimensions of 58.5 mm × 75.4 mm. The Socket SP6, shown in Figure 1, is designed to provide a reliable electrical interconnect between the printed circuit board (PCB) and the 4844 land pads of the OLGA package throughout the life of the product.
— SteinFG, AnandTech Forums
AMD SP6 (LGA4844), Source: SteinFG
One of our readers made a suggestion that 4th Gen EPYC series could now be divided into high-performance 7004 series and efficiency-focused EPYC 5004 CPUs, which makes a lot of sense. Furthermore, the latter option could open more possibilities for AMD to engage the consumer HEDT market.
| RUMORED AMD EPYC Processor Series Specifications | ||||
|---|---|---|---|---|
| VideoCardz | 3rd Gen EPYC “Milan / Milan-X |
” 4th Gen EPYC |
“Genoa / Genoa-X ” |
4th Gen EPYC “Bergamo” |
| 5th Gen EPYC | “Turin” | Launch | 2021 | 2022 |
| 2022 | 2023/2024 | Architecture | 7nm Zen3 | 5nm Zen4 |
| 5nm Zen4c | Zen5 | Socket SP3 (LGA4094) |
SP5 (LGA-6096) SP6 (LGA-4844) |
SP5 (LGA-6096) SP6 (LGA-4844) |
| SP5 (LGA-6096) | SP6 (LGA-4844) | Modules/Chiplets | 8xCCD + 1xIOD | 12xCCD + 1xIOD |
| TBC | TBC | Max Cores | 64C/128T | 96C/192T |
| 128C/256T | 256C/512T | L2 Cache Per Core | 0.5MB | 1MB |
| TBC | TBC | L3 Cache Per CCX | 32MB / 96MB | |
| 32MB / ?? MB | TBC TBC |
memory channels 8-channel |
12-channel (SP5) 6-channel (SP6) |
|
| 12-channel (SP5) | 6-channel (SP6) | 12-channel (SP5) | 6-channel (SP6) | memory support |
| DDR4-3200 | DDR5-5200 | DDR5-5200 DDR5-6000 |
PCIe Lanes 128x Gen4 |
160x Gen5 (SP5) |
| 96x Gen5 (SP6) | 160x Gen5 (SP5) | 96x Gen5 (SP6) TBC |
Max cTDP 280W |
200-400W (SP5) |
70-225W (SP6) 200-400W (SP5)
70-225W (SP6)TBCSource: AnandTech Forums [email protected]_